Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading-Reference-Cited by-同舟云学术

Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading

Published:2019-05-28 Issue:7 Volume:59 Page:1075-1086
ISSN:0014-4851
Container-title:Experimental Mechanics
language:en
Short-container-title:Exp Mech

Author:

Wu B.,Han B.^ORCID,Schumacher J.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Aerospace Engineering

Link

http://link.springer.com/content/pdf/10.1007/s11340-019-00516-0.pdf

Reference28 articles.

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2. Mukherjee S (2015) Multiscale modeling of the anisotropic creep response of SnAgCu single crystal. Ph.D. Dissertation, University of Maryland, College Park

3. Basaran C, Jiang J (2002) Measuring intrinsic elastic modulus of Pb/Sn solder alloys. Mech Mater 34:349–362

4. Tang H, Basaran C (2001) Influence of microstructure coarsening on thermomechanical fatigue behavior of Pb/Sn eutectic solder joints. International Journal of Damage Mechanics 10:235–255

5. Zhang Q (2004) Isothermal mechanical and thermo-mechanical durability characterization of selected Pb-free solders. Ph.D. Dissertation, University of Maryland, College Park

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