Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder
Author:
Funder
NSF GOALI
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference75 articles.
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2. The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints;Arfaei,2008
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4. The kinetics of dislocation climb over hard particles—II. Effects of an attractive particle-dislocation interaction;Arzt;Acta Metall.,1988
5. Threshold stresses for dislocation climb over hard particles: the effect of an attractive interaction;Arzt;Acta Metall.,1986
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