Kinetics of fast-curing epoxy resin cationic thermopolymerization: Propagated by ACE and AM mechanism
Author:
Funder
the ji'an double hundred plan project
Publisher
Springer Science and Business Media LLC
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics
Link
https://link.springer.com/content/pdf/10.1007/s10973-022-11381-w.pdf
Reference34 articles.
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3. Liu S, Gu L, Zhao HC, Chen JM, Yu HB. Corrosion resistance of graphene-reinforced waterborne epoxy coatings. J Mater Sci Technol. 2016;32(5):425–31.
4. Rimdusit S, Ishida H. Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins. Polymer. 2000;41(22):7941–9.
5. Ham YR, Kim SH, Shin YJ, Lee DH, Yang M, Min JH, et al. A comparison of some imidazoles in the curing of epoxy resin. J Ind Eng Chem. 2010;16(4):556–9.
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