Funder
Ministry of Science and Technology, Taiwan
National Science Council
Publisher
Springer Science and Business Media LLC
Reference19 articles.
1. Van de Pol DW, Tierney JK. Free convection heat transfer from vertical fin-arrays. IEEE Trans Parts Hybrids Packag PHP. 1974;10(4):267–71.
2. Arik M, Petroski J, Weaver SE. Thermal challenges in the future generation solid state lighting applications: light emitting diodes. In: The 8th intersociety conference on thermal and thermomechanical phenomena in electronic systems (ITHERM 2002), San Diego, California, USA, June 1; 2002.
3. Arik M, Becker CA, Weaver SE, Petroski J. Thermal management of LEDs: package to system. In: The 3rd international conference on solid state lighting, vol. 5187; 2004. p. 64–75.
4. Li D, Zhang GQ, Pam K, Ma X, Liu L, Cao JX. Numerical simulation on heat pipe for high power LED multi-chip module packaging. In: International conference on electronic packaging technology and high density packaging (ICEPT HDP); 2009. p. 393–7.
5. Lin J., Chiang KN. Thermal mechanical analysis of novel C-TSOP using nonlinear FEM method. In: International symposium on electronic materials and packaging; 2000. p. 371–7.
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