Numerical simulation on heat pipe for high power LED multi-chip module packaging-Reference-Cited by-同舟云学术

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Numerical simulation on heat pipe for high power LED multi-chip module packaging

Published:2009-08 Issue: Volume: Page:
ISSN:
Container-title:2009 International Conference on Electronic Packaging Technology & High Density Packaging
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Author:

Li Dongmei,Zhang G. Q,Pan Kailin,Ma Xiaosong,Liu Lei,Cao Jinxue

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5234372/5270539/05270726.pdf?arnumber=5270726

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analytical Simulation of Spatial Distribution Lambertian Point-Source in LED Chip’s Epitaxial Layers;Springer Proceedings in Physics;2022

2. Thermal Performances and Annual Damages Comparison of MMC Using Reverse Conducting IGBT and Conventional IGBT Module;IEEE Transactions on Power Electronics;2021-09

3. Air-Cooling System Optimization for IGBT Modules in MMC Using Embedded O-Shaped Heat Pipes;IEEE Journal of Emerging and Selected Topics in Power Electronics;2021-08

4. Experimental of ultra-high-power multichip COB LED;Journal of Thermal Analysis and Calorimetry;2018-10-29

5. The development and performance of the high-power LED radiator;International Journal of Thermal Sciences;2017-03

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