Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging-Reference-Cited by-同舟云学术

Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

Published:2012-01-14 Issue:9 Volume:47 Page:4036-4041
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Fuchs Christopher,Schreck Timo,Kaloudis Michael

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-012-6257-x.pdf

Reference23 articles.

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3. Kang SK, Sarkhel AK (1994) JEM 23(8):701

4. Suganuma K (2002) ESPEC Technol Rep 13:1

5. Hwang JS (2001) Environment-friendly electronics: lead-free technology. Electrochemical Publications, Isle of Man

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