Growth behavior of compounds due to solid-state reactive diffusion between Cu and Al-Reference-Cited by-同舟云学术

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Growth behavior of compounds due to solid-state reactive diffusion between Cu and Al

Published:2012-03-09 Issue:12 Volume:47 Page:4955-4964
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Meguro K.,O M.,Kajihara M.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-012-6370-x.pdf

Reference43 articles.

1. Massalski TB, Okamoto H, Subramanian PR, Kacprzak L (1990) Binary alloy phase diagrams, vol 1–3. ASM International, Materials Park, OH

2. Lustman B, Mehl RF (1942) Trans Met Soc AIME 147:369

3. Horstmann D (1953) Stahl Eisen 73:659

4. Storchheim S, Zambrow JL, Hausner HH (1954) Trans Met Soc AIME 200:269

5. Kidson GV, Miller GD (1964) J Nucl Mater 12:61

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