Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures-Reference-Cited by-同舟云学术

Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures

Published:2023-10 Issue: Volume:161 Page:107986
ISSN:0966-9795
Container-title:Intermetallics
language:en
Short-container-title:Intermetallics

Author:

O Minho^ORCID,Tanaka Yuki,Kobayashi Equo

Funder

Light Metals Educational Foundation

Iketani Science and Technology Foundation

Iron and Steel Institute of Japan

Light Metal Educational Foundation

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference57 articles.

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