Retardation of grain growth in electrodeposited Cu by an electric field-Reference-Cited by-同舟云学术

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Retardation of grain growth in electrodeposited Cu by an electric field

Published:2007-06 Issue:11 Volume:42 Page:3994-4003
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Jung Kang,Conrad Hans

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/article/10.1007/s10853-006-0177-6/fulltext.html

Reference36 articles.

1. Conrad H, Guo Z, Sprecher AF (1989) Scripta Metall 23:821

2. Hu W, Rath BB (1970) Metall Trans 1:3181

3. Lücke KL, Stüwe HP (1963) In: Himinal L (ed) Recovery and recrystallization of metals. Gordan and Breach Science Publ., New York, p 171

4. Cahn JW (1962) Acta Metall 9:789

5. Cottrell AH (1853) Dislocations and plastic flow in crystals. Oxford University Press, Oxford, p 95

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