Characterization of the isothermal solidification process in the Ni/Au–Ge layer system
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-015-8952-x.pdf
Reference26 articles.
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3. Lis A, Park MS, Arroyave R, Leinenbach C (2014) Early stage growth characteristics of Ag3Sn intermetallic compounds during solid-solid and solid-liquid reactions in the Ag-Sn interlayer system: experiments and simulation. J Alloy Comp 617:763–773
4. Bosco NS, Zok FM (2004) Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn system. Acta Mater 52:2965–2972
5. Bosco NS, Zok FM (2005) Strength of joints produced by transient liquid phase bonding in the Cu-Sn system. Acta Mater 53:2019–2027
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