Author:
Goh Yingxin,Haseeb A. S. M. A.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference39 articles.
1. Briggs E (2011) Advantages of bismuth-based alloys for low temperature Pb-free soldering and rework. In: International conference on soldering & reliability, surface mount technology association (SMTA), Toronto
2. He H, Xu G, Guo F (2010) Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints. J Mater Sci 45:334. doi: 10.1007/s10853-009-3939-0
3. Lee Y-G, Park J-G, Lee C-W, Jung J-P (2011) Electrodeposition of the Sn-58 wt%Bi layer for low-temperature soldering. Met Mater Int 17:117. doi: 10.1007/s12540-011-0216-y
4. Wang J, Liu HS, Liu LB, Jin ZP (2006) Interfacial reaction between Sn-Bi alloy and Ni substrate. J Electron Mater 35:1842. doi: 10.1007/s11664-006-0166-1
5. Yoon JW, Lee CB, Jung SB (2002) Interfacial reactions between Sn-58 mass% Bi eutectic solder and (Cu, electroless Ni-P/Cu) substrate. Mater Trans 43:1821
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献