Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol

Abstract

AbstractDurability of sintered Cu joints under thermal aging in the air was investigated for the reduction of Cu2O using Cu2O/polyethylene glycol (PEG) mixture. Thermal analysis of the Cu2O/PEG paste showed that the molecular weight of PEG influences the redox reaction and the subsequent bonding related to the combustion of the reducing organic solvent. Sintered Cu joints using PEG 400 exhibited high joint strength (above 30 MPa) in shear tests, even for the bonding temperature of 280 °C. The sintered Cu joints exhibited slightly increased strength during thermal aging at 250 °C in air, which was also confirmed by the microscale tensile test used for evaluating the fracture behavior of the sintered Cu structure. Microstructural analysis, including the evaluation of the crystal orientation, revealed a small change in the microstructure of sintered joints during aging. Transmission electron microscopy revealed the presence of organic membranes on slightly oxidized sintered Cu grains before thermal aging, and additional oxidation was observed after thermal aging. The progress of sintering during thermal aging in vacuum was different than that in air. It was considered that the formation of a thin Cu2O layer, controlled by the presence of organic membranes, contributed to the suppression of Cu sintering. Graphical abstract