Thermal and mechanical separations of silicon layers from hydrogen pattern-implanted wafers-Reference-Cited by-同舟云学术

Thermal and mechanical separations of silicon layers from hydrogen pattern-implanted wafers

Published:2001-08 Issue:8 Volume:30 Page:960-964
ISSN:0381-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Yun C. H.,Cheung N. W.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02657717.pdf

Reference16 articles.

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4. C.H. Yun, A.B. Wengrow, N.W. Cheung, Y. Zheng, R.J. Welty, Z.F. Guan, K.V. Smith, P.M. Asbeck, E.T. Yu, and S.S. Lau,Appl. Phys. Lett. 73, 2772 (1998).

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