Author:
Anderson Dennis,Haak Ron,Ogden Cameron,Tench Dennis,White John
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrochemistry,General Chemical Engineering
Reference9 articles.
1. D. S. Stoychev, I. Vitanova, T. Vitanova and S. Rashkov,Surf. Tech. 10 (1980) 209.
2. R. Haak, C. Ogden and D. Tench,Plating Surf. Fin. 68(10) (1981) 59.
3. C. Ogden, D. Tench and J. White,ibid 67(12) (1980) 50.
4. R. Haak, C. Ogden and D. Tench,J. Appl. Electrochem. 11 (1981) 771.
5. W. Freitag, C. Ogden, D. Tench and J. White,Plating Surf. Fin. 70(10) (1983) 55.
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