Evaluation of agitation within circuit board through ? holes-Reference-Cited by-同舟云学术

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Evaluation of agitation within circuit board through ? holes

Published:1981-11 Issue:6 Volume:11 Page:771-780
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Haak R.,Ogden C.,Tench D.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF00615182.pdf

Reference13 articles.

1. O. Kardos and D. Foulke, ?Advances in Electrochemistry and Electrochemical Engineering?, Vol. 2, Interscience Publishers, New York (1962).

2. D. Tench and C. Ogden,J. Electrochem. Soc. 125 (1978) 1218.

3. C. Ogden and D. Tench,Plating Surf. Finishing 66 (1979) 30.

4. T. Kessler and R. Alkire,ibid 63 (1976) 22.

5. T. Kessler and R. Alkire,J. Electrochem. Soc. 123 (1976) 990.

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Agitation: the most Versatile Degree of Freedom for Surface Finishers;Transactions of the IMF;2003-01

2. Modelling of through-hole electrodeposition - Part I: Effect of electrical migration;Journal of Applied Electrochemistry;2001

3. MODELING OF ACID COPPER ELECTROPLATING: A REVIEW;Journal of Electronics Manufacturing;1998-03

4. Physical properties of pulsed current copper electrodeposits;Journal of Materials Science;1995

5. Current Distribution in a Jet Through‐Hole System during Periodic Electrolysis;Journal of The Electrochemical Society;1993-05-01

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