Author:
Shen Chunjian,Zhu Zengwei,Zhu Di
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference30 articles.
1. S. Hernandez, T. Engelberg, D.L. Scenini et al., Manufacturing Technology for Implementing Geological Disposal: Electroforming of Copper Canisters, Mineral. Mag., 2016, 79, p 1521–1528
2. G. Chatzipirpiridis, O. Ergeneman, J. Pokki et al., Electroforming of Implantable Tubular Magnetic Microrobots for Wireless Ophthalmologic Applications, Adv. Healthc. Mater., 2015, 4, p 209–214
3. M.K. Hota, D.H. Nagaraju, M.N. Hedhili et al., Electroforming Free Resistive Switching Memory in Two-dimensional VOx Nanosheets, Appl. Phys. Lett., 2015, 31, p 666
4. Q.D. Cao, L. Fang, J.M. Lv et al., Effects of Pulse Reverse Electroforming Parameters on the Thickness Uniformity of Electroformed Copper Foil, Trans. Inst. Met. Finish., 2018, 96, p 108–112
5. F. Ebrahimi, G.R. Bourne, M.S. Kelly et al., Mechanical Properties of Nanocrystalline Nickel Produced by Electrodeposition, Nanostruct. Mater., 1999, 11, p 343–350
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