1. F. Ebrahimi, D. Kong, T. E. Mathews, and Q. Zhai, in Processing and Fabrication of Advanced Materials VII, ed. Srivastan and Khor, p. 509 (1998).
2. J. K. Dennis and J. J. Fuggle, Electroplating Metal Finishing. Jan., 16 (1968).
3. ASTM B 832–93, Standard Guide for Electroforming with Nickel and Copper, American Society for Testing and Materials Annual Book, vol. 02.05.
4. Temperature dependence of hardness of nanocrystalleve copper in low-temperature range