1. P. Lall, D. Zhang, and V. Yadav, High Strain Rate Constitutive Behavior of SAC105 and SAC305 Lead-Free Solder During Operation at High Temperature, Microelectron. Reliab., 2016, 62, p 4–17
2. L. Yang, J.G. Ge, Y.C. Zhang, J. Dai, H.X. Liu, and J.C. Xiang, Investigation on the Microstructure, Interfacial IMC Layer and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints, J. Electron. Mater., 2016, 25, p 5195–5200
3. T.W. Hu, Y. Li, and Y.C. Chan, Effect of Nano Al2O3 Particles Doping on Electromigration and Mechanical Properties of Sn–58Bi Solder Joints, Microelectron. Reliab., 2015, 55, p 1226–1233
4. X. Chen, J. Zhou, and F. Xue, Mechanical Deformation Behavior and Mechanism of Sn-58Bi Solder Alloys Under Different Temperatures and Strain Rates, Mater. Sci. Eng. A, 2016, 622, p 251–257
5. D.L. Ma and P. Wu, Effects of Coupled Stressing and Solid-State Aging on the Mechanical Properties of Graphene Nanosheets Reinforced Sn-58Bi-0.7Zn Solder Joint, Mater Sci Eng A, 2015, 651, p 499–506