Suppression of Interdiffusion in Copper/Tin Thin Films-Reference-Cited by-同舟云学术

Suppression of Interdiffusion in Copper/Tin Thin Films

Published:2012-02-08 Issue:8 Volume:21 Page:1724-1727
ISSN:1059-9495
Container-title:Journal of Materials Engineering and Performance
language:en
Short-container-title:J. of Materi Eng and Perform

Author:

Etschmaier Harald,Torwesten Holger,Eder Hannes,Hadley Peter

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s11665-011-0090-2.pdf

Reference14 articles.

1. E. Bradley and K. Banerji, Effect of PCB Finish on the Reliability and Wettability of Ball Grid Array Packages, IEEE Trans. Compon. Packag. Manuf. Technol. B, 2002, 19, p 320–330

2. K. Guth, D. Siepe, J. Görlich, H. Torwesten, R. Roth, F. Hille, et al., New Assembly and Interconnects Beyond Sintering Methods, PCIM 2010 Conference Proceedings, 2010

3. Directive 2002/95/EC of the European Parliament and of the Council, 2003

4. R. Vogel, Aging Characteristics of Immersion Tin Surface Finishes: An Investigation of This Surface Finish’s Aging and Its Reliability During Soldering, Circuits Assembly, December 1, 2003

5. Y.-J. Oh and S.-Y. Oh, Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed With Sn-3.5Ag-0.7Cu, J. Electron. Mater, 2009, 38, p 2554–2562

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