Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. K. Zeng, and K.N. Tu, Mater. Sci. Eng., R 38, 55 (2002). doi: 10.1016/S0927-796X(02)00007-4 .
2. E. Bradley, NEMI Meeting (NEMI-National Electronics Manufacturing Initiative, Inc., Herndon, VA) (Anaheim, CA, February 23, 1999).
3. K. Suganuma, Curr. Opin. Solid State Mater. Sci. 5, 55 (2001). doi: 10.1016/S1359-0286(00)00036-X .
4. J. Glazer, J. Electron. Mater. 23, 693 (1994). doi: 10.1007/BF02651361 .
5. S.K Kang, and A.K. Sarkhel, J. Electron. Mater. 23, 701 (1994). doi: 10.1007/BF02651362 .
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Suppression of Interdiffusion in Copper/Tin Thin Films;Journal of Materials Engineering and Performance;2012-02-08