Thermal Properties, Electrochemical Behavior, and Microstructure of Zn-5Sn-2Cu-1.5Bi-xRE High-Temperature Solder
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11665-015-1416-2.pdf
Reference27 articles.
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