Author:
Awayes J.,Reinkensmeier I.,Wagner G.,Hausner S.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference21 articles.
1. S.Hausner, Potential von Nanosuspensionen zum Fügen bei Niedrigen TEMPERATUREN. Werkstoffe und Werkstofftechnische Anwendungen, 2015, (56), https://nbn-resolving.org/urn:nbn:de:bsz:ch1-qucosa-191211
2. P.R. Couchman and W.A. Jesser, Thermodynamic Theory of Size Dependence of Melting Temperature in Metals, Nature, 1977, 269, p 481–483.
3. DVS Media Arbeitskreis V6.1 (Hrsg.): Hartlöten: Eine Einführung. Düsseldorf, 2018
4. K.S. Siow and Y.T. Lin, Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study, J. Electron. Packag. Trans. ASME, 2016, 138, p 020804. https://doi.org/10.1115/1.4033069
5. J. Yan, G. Zou, A. Wu, J. Ren, J. Yan, A. Hu and Y.N. Zhou, Pressureless Bonding Process Using Ag Nanoparticle Paste for flexIble Electronics Packaging, Scri. Mater., 2012, 66, p 582–585. https://doi.org/10.1016/j.scriptamat.2012.01.007
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