Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films-Reference-Cited by-同舟云学术

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Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films

Published:2023-08-14 Issue: Volume: Page:
ISSN:1059-9495
Container-title:Journal of Materials Engineering and Performance
language:en
Short-container-title:J. of Materi Eng and Perform

Author:

Lai Yu-Chang,Yang Zi-Hong,Chen Yin-Hsuan,Chen Yen-Ting,Lin Ang-Ying,Chuang Tung-Han

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s11665-023-08534-9.pdf

Reference24 articles.

1. D. L. Lewis and H. H. S. Lee, Testing Circuit-Partitioned 3D IC Designs, in 2009 IEEE Computer Society Annual Symposium on VLSI, p 139–144, IEEE, May 2009

2. J. H. Lau, Evolution, Challenge, and Outlook of TSV, 3D IC Integration and 3D Silicon Integration, in 2011 International symposium on advanced packaging materials (APM), p 462–488, IEEE, Oct 2011

3. T. Frank, S. Moreau, C. Chappaz, L. Arnaud, P. Leduc, A. Thuaire, and L. Anghel, Electromigration Behavior of 3D-IC TSV Interconnects, in 2012 IEEE 62nd Electronic Components and Technology Conference, p 326–330, IEEE, May, 2012

4. T. Tanaka, 3D-IC Technology and Reliability Challenges, in 2017 17th International Workshop on Junction Technology (IWJT), p 51–53, IEEE June, 2017

5. H. Ye, C. Basaran and D. Hopkins, Thermomigration in Pb–Sn Solder Joints Under Jouleheating During Electric Current Stressing, Appl. Phys. Lett., 2003, 82(7), p 1045–1047.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of (1 1 1) texture on bonding strength in low-temperature bonding of nanotwinned Ag films: Experimental insights and void closure modeling;Materials & Design;2024-04

2. Improvement of Silver-Sintered Die Bonding of SiC/DBC Power Modules Through Backside Metallization With High-Density (111) Orientation Ag Nanotwinned Films;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

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