1. C.F. Coombs, Jr., Printed Circuits Handbook, 6th ed., McGraw-Hill, New York, 2008
2. D. Adams, T. MacFadden, R. Maradiaga, R. Curry, Understanding PCB Design Variables That Contribute to Warpage During Module-Carrier Attachment, in SMTA International Conference Proceedings (2016).
3. A. Mircea, Main Aspects Concerning PCB manufacturing optimization, Circuit World, 2012, 38(2), p 75–82
4. R. Polanský, P. Prosr, and M. Cermák, Determination of the Thermal Endurance of PCB FR4 Epoxy Laminates Via Thermal Analyses, Polym. Degrad. Stab., 2014, 105, p 107–115
5. E. T. Haugan, P. Dalsjø, Norwegian Defence Research Establishment, Characterization of the Material Properties of Two FR4 Printed Circuit Board Laminates, ISBN 978-82-464-2322-7. (2014).