Friction riveting of FR4 substrates for printed circuit boards: Influence of process parameters on process temperature development and joint properties-Reference-Cited by-同舟云学术

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Friction riveting of FR4 substrates for printed circuit boards: Influence of process parameters on process temperature development and joint properties

Published:2023-05 Issue: Volume:24 Page:4639-4649
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Rodrigues Camila F.,Blaga Lucian^ORCID,Klusemann Benjamin^ORCID

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference33 articles.

1. Printed Circuit Board Market Size, Industry Report 2022–2030, (1): 1–3. Available at: https://www.precedenceresearch.com/printed-circuit-board-market. Accessed 23 March 2023.

2. A lean based overview on sustainability of printed circuit board production assembly;Esfandyari;Procedia CIRP,2015

3. High-density interconnect technology assessment of printed circuit boards for space applications;Cauwe;Journal of Microelectronics and Electronic Packaging,2020

4. Printed circuits handbook;Coombs,2008

5. Solderless press-fit interconnections: a mechanical study of solid and compliant contacts;Scaminaci;Manuf Technol IEEE Trans,1977

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