Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging-Reference-Cited by-同舟云学术

Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

Published:2004-07 Issue:1-3 Volume:13 Page:417-422
ISSN:1385-3449
Container-title:Journal of Electroceramics
language:en
Short-container-title:J Electroceram

Author:

Tummala Rao R.,Raj P. Markondeya,Atmur Steve,Bansal Shubhra,Banerji Sounak,Liu Fuhan,Bhattacharya Swapan,Sundaram Venky,Shinotani Ken-ichi,White George

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Materials Chemistry,Mechanics of Materials,Condensed Matter Physics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10832-004-5135-6.pdf

Reference7 articles.

1. K.F. Eustice, T.J. Lehman, A. Morales, M.C. Munson, S. Edlund, and M. Guillen, IBM Systems Journal, 38, 575 (1999).

2. K. Tanida, et al., in Proc. International Conference on Electronic Packaging (IEEE/CPMT chapter, Tokyo, Japan, 2002), p. 333.

3. Rao R. Tummala, Advancing Microelectronics, 26, 29 (1999).

4. International Technology Roadmap for Semiconductors Roadmap, http://public.itrs.net

5. R. Dunne and S. Sitaraman, in Proc. 48th Electronic Components and Technology Conference (IEEE, NJ Piscataway, 1998), p. 353.

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