Analyzing and mitigating the internal single-event transient in radiation hardened flip-flops at circuit-level

Author:

Liang Bin,Song RuiQiang

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Reference14 articles.

1. Gadlage M J, Ahlbin J R, Narasimham B, et al. Scaling trends in SET pulse widths in Sub-100 nm bulk CMOS processes. IEEE Trans Nucl Sci, 2010, 57: 3336–3341

2. Jagannathan S, Gadlage M J, Bhuva B L, et al. Independent measurement of SET pulse widths from N-hits and P-hits in 65-nm CMOS. IEEE Trans Nucl Sci, 2010, 57: 3386–3391

3. Ahlbin J R, Gadlage M J, Ball D R, et al. The effect of layout topology on single-event transient pulse quenching in a 65 nm bulk CMOS process. IEEE Trans Nucl Sci, 2010, 57: 3380–3385

4. Atkinson N M, Witulski A F, Holman W T, et al. Layout technique for single-event transient mitigation via pulse quenching. IEEE Trans Nucl Sci, 2011, 56: 885–890

5. Chen J, Chen S, Liang B, et al, Simulation study of the layout technique for P-hit single-event transient mitigation via the source isolation. IEEE Trans Dev Mat Rel, 2012, 12: 501–509

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