Adhesive properties study on the interfaces of AlN and metal of Pd, Ag and Cu
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11431-010-4197-8.pdf
Reference6 articles.
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2. Deitch C, Crawford A, Meier A. Surface preparation of aluminum nitride for metallization: Effect of temperature on surface reactivity. Mater Manuf Processes, 2005, 20: 863–886
3. Chow G M, Kurihara L K, Ma D, et al. Alternative approach to electroless Cu metallization of AIN by a nonaqueous polyol process. Appl Phys Lett, 1997, 70: 2315–2317
4. Sun Y J, Eastman L F. Electrical comparison of Ta/Ti/Al/Mo/Au and Ti/Al/Mo/Au ohmic contacts on undoped GaN HEMTs structure with A1N interlayer. Int J High Speed Electro Sys, 2007, 17: 85–89
5. Liu Z P. Studies on Aluminum Nitride Ceramics and Surface Metallization. Dissertation of Doctoral Degree. Tianjin: Tianjin University, 2008. 17
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