Alternative approach to electroless Cu metallization of AlN by a nonaqueous polyol process
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.118847
Reference8 articles.
1. Thick Film and Direct Bond Copper Forming Technologies for Aluminum Nitride Substrate
2. Morphology and adhesion strength in electroless Cu metallized AlN substrate
3. The influence of moisture on surface properties and insulation characteristics of AlN substrates
4. R. Chanchani, Proceedings of the 38th ECC Conference Mater. Res., 1988, p. 84
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