Evolution of surface microstructure of Cu-50Cr alloy treated by high current pulsed electron beam

Author:

Chai LinJiang,Zhou ZhiMing,Xiao ZhiPei,Tu Jian,Wang YaPing,Huang WeiJiu

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Reference43 articles.

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2. Rieder W F, Schussek M, Glatzle W, et al. The influence of composition and Cr particle size of Cu/Cr contacts on chopping current, contact resistance, and breakdown voltage in vacuum interrupters. IEEE Trans CPMT, 1989, 12: 273–283

3. Wang Y P, Ding B J. The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials. IEEE Trans CPMT, 1999, 22: 467–472

4. Ding B J, Yang Z M, Wang X T. Influence of microstructure on dielectric strength of CuCr contact materials in a vacuum. IEEE Trans CPMT, 1996, 19: 76–81

5. Yang Z M. Dissertation for the Doctor Degree. Xi’an: Xi’an Jiaotong University, 1996

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