Modeling of void closure in diffusion bonding process based on dynamic conditions
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11431-012-4927-1.pdf
Reference16 articles.
1. Elrefaey A, Tillmann W. Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer. J Mater Process Tech, 2009, 209(5): 2746–2752
2. Mahendran G, Balasubramanian V, Senthilvelan T. Developing diffusion bonding windows for joining AZ31B magnesium-AA2024 aluminium alloys. Mater Des, 2009, 30(4): 1240–1244
3. Lagos M, Retamal C. An alternate theoretical approach to solid-state bonding. Scripta Mater, 2011, 64(5): 402–405
4. Hamilton C H. Titanium Science and Technology. New York: Plenum Press, 1973. 625–648
5. Garmong G, Paton N E, Argon A S. Attainment of full interfacial contact during diffusion bonding. Metall Mater Trans A, 1975, 6(7): 1268–1279
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