Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
Reference16 articles.
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4. Joining of silicon nitride to metal (Mo and Ti) Using a Cu-foil interlayer;Flores;Mater. Sci. Forum,2006
5. Variation in the reaction zone and its effects on the strength of diffusion bonded titanium–stainless steel couple;Ghosh;Mater. Sci. Eng. A,2005
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