The kinetics of atomic diffusion to stacking faults and the related special problems in cold-worked alpha brasses-Reference-Cited by-同舟云学术

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The kinetics of atomic diffusion to stacking faults and the related special problems in cold-worked alpha brasses

Published:1979-10 Issue:10 Volume:10 Page:1505-1513
ISSN:0360-2133
Container-title:Metallurgical Transactions A
language:en
Short-container-title:MTA

Author:

Oĝurtani Tarik Ömer

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02812016.pdf

Reference39 articles.

1. H. Suzuki:Sci. Rep. Res. Inst. Tohoku Univ., 1952, vol. A4, p. 455.

2. H. Suzuki:Dislocations and Mechanical Properties of Crystals, p. 361, J. Wiley, NY, 1957.

3. H. Suzuki:J. Phys. Soc. Jpn, 1962, vol. 17, p. 322.

4. P. A. Flinn:Acta Met., 1958, vol. 6, p. 631.

5. P. A. Flinn:Strengthening Mechanism in Solids, p. 21, ASM, Metal Park, OH, 1962.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces;International Journal of Solids and Structures;2005-06

2. Computer simulation of void growth dynamics under the action of electromigration and capillary forces in narrow thin interconnects;Journal of Applied Physics;2001-08

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