Influence of pH, immersion time, and benzotriazole concentration on copper corrosion in citric acid based slurries
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://link.springer.com/content/pdf/10.1007/s11434-011-4420-4.pdf
Reference25 articles.
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3. Oliver M R. Chemical Mechanical Planarization of Semiconductor Materials. New York: Springer, 2004. 1
4. Tsai T H, Yen S C. Localized corrosion effects and modifications of acidic and alkaline slurries on copper chemical mechanical polishing. Appl Surface Sci, 2003, 210: 190–205
5. Prasad Y N, Ramanathan S. Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor. Electrochim Acta 2007, 52: 6353–6358
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1. Construction of Al-BTA passivation film on the surface of electrolytic copper foil and study of corrosion resistance mechanism;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2023-11
2. Effect of the pH in the growth of benzotriazole model layers at realistic environmental conditions;Corrosion Science;2018-10
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