Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://link.springer.com/content/pdf/10.1007/s11434-006-2043-y.pdf
Reference13 articles.
1. Abtew M, Selvaduray G. Lead-free solders in microelectronics. Mater Sci Eng R, 2000, 27: 95–141
2. Zeng K, Tu K N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater Sci Eng R, 2002, 38: 55–105
3. Wu C M L, Yu D Q, Law C M T, et al. Properties of lead-free solder alloys with rare earth element additions. Mater Sci Eng R, 2004, 44: 1–44
4. Kim K S, Huh S H, Suganuma K. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys. Mater Sci Eng A, 2002, 333: 106–114
5. Ochoa F, Williams J J, Chawla N. Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5 wt.% Ag solder. J Electron Mater, 2003, 32: 1414–1420
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