Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints-Reference-Cited by-同舟云学术

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Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints

Published:1989-11 Issue:6 Volume:18 Page:671-680
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Frear D.,Grivas D.,Morris J. W.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02657518.pdf

Reference20 articles.

1. E. R. Bangs and R. E. Beal, Welding Res. Supp.54, 377s (1975).

2. J. F. Burgess, R. O. Carlson, H. H.GlascockII, C. A. Neugebauer, and H. F. Webster, IEEECHMT-7, 405 (1984).

3. E. Levine and J. Ordenez, IEEE Trans. Components, Hybrids, and Manufacturing Tech.,CHMT-4, 515 (1981).

4. S. K. Kang, N. D. Zommer, D. L. Feucht, and R. W. Heckel, IEEE Trans. Parts, Hybrids, and PackagingPHP-13, 318 (1977).

5. H. N. Keller, IEEE Trans. Components, Hybrids, and Manufacturing Tech.CHMT-4, 132 (1981).

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