Joining of Al2O3 to Cu with Cu-Sn-Ti active brazing filler alloy-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Joining of Al2O3 to Cu with Cu-Sn-Ti active brazing filler alloy

Published:2022-05-06 Issue:7 Volume:66 Page:1471-1479
ISSN:0043-2288
Container-title:Welding in the World
language:en
Short-container-title:Weld World

Author:

Yuan Linlin,Wang Wei,Huang Xiaomeng,Qi Yuefeng,Li Xiaoying

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

https://link.springer.com/content/pdf/10.1007/s40194-022-01305-5.pdf

Reference30 articles.

1. Chen HY, Ren XW, Guo W (2020) Effects of glass composition and joining parameters on microstructural evolution and mechanical properties of Al2O3/Cu joints brazed with Bi2O3-B2O3-ZnO glass. J Manuf Process 56:735–745

2. W. Tillmann, Jan Pfeiffer, L. Wojarski. Influencing factors on the reactive wetting of Cu-Sn-Ti and Ag-Cu-Ti alloys on silicon carbide-microstructural observations, effects and multivariate modeling. Advances in Science and Technology, 2014, 88:172–177.

3. Fu W, Song X G, Hu S P. Brazing copper and alumina metallized with Ti-containing Sn0.3Ag0.7Cu metal powder. Materials and Design, 2015, 87: 579–585.

4. Wu YC, Li H, Qu WQ et al (2020) Ultrasonic-assisted bonding of Al2O3 ceramic, Cu, and 5056 aluminum alloy with Sn-Zn-Sb solders. Welding in the World 64:247–256

5. Hafez KM, El-Sayed MH, Naka M (2005) Joining of alumina ceramics to metals. Sci Technol Weld Joining 10(2):125–130

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructural characterizations of metallized Al2O3 before/after surface treatment and Al2O3/Cu soldered joint;Materials Characterization;2024-11

2. Cu metallization of Al2O3 ceramics via CuO reduction: Role of SiO2 additive and sintering atmosphere;Ceramics International;2024-07

3. Microstructure and mechanical properties of Al₂O₃ ceramic and copper joints brazed with AgCuInTi brazing alloy;International Journal of Applied Ceramic Technology;2024-06-22

4. The Joining of Alumina to Hastelloy by a TiZrCuNi Filler Metal: Wettability and Interfacial Reactivity;Materials;2023-02-28

5. Microstructure and hot deformation behavior of the Cu-Sn-Ni-Zn-Ti(-Y) alloy;Materials Characterization;2023-02

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3