Analysis of adhesion strength of laminated copper layers in roll-to-roll lamination process-Reference-Cited by-同舟云学术

Analysis of adhesion strength of laminated copper layers in roll-to-roll lamination process

Published:2015-08 Issue:9 Volume:16 Page:2013-2020
ISSN:2234-7593
Container-title:International Journal of Precision Engineering and Manufacturing
language:en
Short-container-title:Int. J. Precis. Eng. Manuf.

Author:

Lee Jongsu,Park Sungsik,Park Janghoon,Cho Young Seek,Shin Kee-Hyun,Lee Dongjin

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s12541-015-0262-3.pdf

Reference27 articles.

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3. Lee, Y.-Y., Tu, K.-H., Yu, C.-C., Li, S.-S., Hwang, J.-Y., et al., “Top Laminated Graphene Electrode in a Semitransparent Polymer Solar Cell by simultaneous Thermal Annealing/Releasing Method,” ACS Nano, Vol. 5, No. 8, pp. 6564–6570, 2011.

4. Lu, Y., Alexander, C., Xiao, Z., Yuan, Y., Zhang, R., and Huang, J., “Utilizing Insulating Nanoparticles as the Spacer in Laminated Flexible Polymer Solar Cells for Improved Mechanical Stability,” Nanotechnology, Vol. 23, No. 34, Paper No. 344007, 2012.

5. Duggal, A. R., Heller, C. M., Shiang, J. J., Liu, J., and Lewis, L. N., “Solution-Processed Organic Light-Emitting Diodes for Lighting,” Journal of Display Technology, Vol. 3, No. 2, pp. 184–192, 2007.

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