Author:
Vo Truong Quoc,Kim BoHung
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Reference27 articles.
1. Kapitza, P., “The Study of Heat Transfer in Helium II,” Journal of Physics(USSR), vol. 4, no. 1–6, pp. 181–210, 1941.
2. Pollack, G. L., “Kapitza Resistance,” Reviews of Modern Physics, vol. 41, no. 1, pp. 48, 1969.
3. Swartz, E. T. and Pohl, R. O., “Thermal Boundary Resistance,” Reviews of Modern Physics, vol. 61, no. 3, pp. 605–668, 1989.
4. Allen, M. P. and Tidesley, D. J., “Computer Simulation of Liquids,” Oxford University Press, p. 21, 164, 240, 1989.
5. Kim, B. H., Beskok, A., and Cagin, T., “Thermal Interactions in Nanoscale Fluid Flow: Molecular Dynamics Simulations with Solid-Liquid Interfaces,” Microfluidics and Nanofluidics, vol. 5, no. 4, pp. 551–559, 2008.
Cited by
60 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献