Analysis of Parameters Affecting the Surface Roughness in Sapphire Wafer Polishing Using Nanocrystalline–Microcrystalline Multilayer Diamond CVD Pellets-Reference-Cited by-同舟云学术

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Analysis of Parameters Affecting the Surface Roughness in Sapphire Wafer Polishing Using Nanocrystalline–Microcrystalline Multilayer Diamond CVD Pellets

Published:2019-02-22 Issue:6 Volume:20 Page:883-891
ISSN:2234-7593
Container-title:International Journal of Precision Engineering and Manufacturing
language:en
Short-container-title:Int. J. Precis. Eng. Manuf.

Author:

Yun Joong-Cheul,Lee Eung-seok,Lee Choong-hyun,Lim Young-kyun,Lim Dae-Soon

Funder

Ministry of Trade, Industry and Energy

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering

Link

http://link.springer.com/article/10.1007/s12541-019-00057-5/fulltext.html

Reference21 articles.

1. Aida, H., Doi, T., Takeda, H., Katakura, H., Kim, S. W., Koyama, K., et al. (2011). Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials. Current Applied Physics, 12, S41–S46.

2. Neauport, J., Destribats, J., Maunier, C., Ambard, C., Cormont, P., Pintault, B., et al. (2010). Loose abrasive slurries for optical glass lapping. Applied Optics, 49, 5736–5745.

3. Dong, Z., Cheng, H., Ye, X., & Tam, H.-Y. (2014). Subsurface damage of fused silica lapped by fixed-abrasive diamond pellets. Applied Optics, 53(26), 5841–5849.

4. Kim, H.-M., Manivannan, R., Moon, D.-J., Xiong, H., & Park, J.-G. (2013). Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates. Wear, 302, 1340–1344.

5. Jeong, H. B., Lee, H. S., Choi, S. H., Lee, Y. K., & Jeong, H. D. (2012). Prediction of real contact area from microtopography on CMP Pad. Journal of Advanced Mechanical Design, Systems, and Manufacturing, 6(1), 113–120.

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2. Magnetization and self-sharpening mechanism of polymerized diamond abrasive based on magnetorheological polishing technology;Diamond and Related Materials;2024-01

3. Chemo-mechanical grinding by applying grain boundary cohesion fixed abrasive for monocrystal sapphire;Precision Engineering;2021-07

4. Characteristic of SiC Slurry in Ultra Precision Lapping of Sapphire Substrates;International Journal of Precision Engineering and Manufacturing;2021-04-13

5. MASS PRODUCTION OF HFCVD DIAMOND-COATED WIRE-DRAWING DIES WITHOUT FILAMENT THROUGH THE HOLE;Surface Review and Letters;2021-01-08

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