Publisher
Springer Berlin Heidelberg
Reference35 articles.
1. Chou SY, Krauss PR, Renstrom PJ (1995) Imprint of sub-25 nm vias and trenches in polymers. Appl Phys Lett 67:3114–3116
2. Okada M, Kang YJ, Nakamatsu IM, Kanda K, Haruyama Y, Matsui S (2009) Characterization of nanoimprint resin and antisticking layer by scanning probe microscopy. J Photopolymer Sci Technol 22:167–169
3. Brockmann W, Geiß PL, Klingen J (2009) Adhesive bonding: materials, applications and technology. Wiley, Weinheim
4. Alphonsus VP (2002) Adhesion and adhesives technology: an introduction. Hanser, Zurich
5. Matthias W (2009) Hot embossing: theory and technology of microreplication. William Andrew Inc, New York
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