1. Energetic Cs+ion interaction with common microelectronic materials—An investigation of a future FIB candidate source;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2016-11
2. Structural characterization of He ion microscope platinum deposition and sub-surface silicon damage;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2012-07
3. Strategy for focused ion beam compound material removal for circuit editing;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2012-01
4. E-beam invasiveness on 65 nm complementary metal-oxide semiconductor circuitry;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2011-03
5. Characterization of damage induced by FIB etch and tungsten deposition in high aspect ratio vias;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2011-01