Author:
Greenzweig Yuval,Drezner Yariv,Raveh Amir,Sidorov Oleg,Livengood Richard H.
Subject
Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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1. Noninvasive Backside Circuit Edit Workflow using Low-kV STI Exposure;2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2020-07-20
2. Energetic Cs+ion interaction with common microelectronic materials—An investigation of a future FIB candidate source;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2016-11
3. Structural characterization of He ion microscope platinum deposition and sub-surface silicon damage;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2012-07