Particles Detection and Analysis of Hard Disk Substrate after Post-CMP Cleaning
Author:
Publisher
Springer Berlin Heidelberg
Link
http://link.springer.com/content/pdf/10.1007/978-3-642-03653-8_256.pdf
Reference18 articles.
1. G. Zhang, G. Burdick etc., Assessment of post-CMP cleaning mechanisms using statistically-designed experiments, Thin Solid Films 332 (1998) 379–384
2. Quan Qi and Giles J. Brereton, Mechanisms of Removal of Micron-Sized Particles by High-Frequency Ultrasonic Waves, IEEE transactions on ultrasonics, ferroelectrics, and frequency control, VOL. 42, NO. 4, JULY 1995
3. P. B. Zantye, A. Kumar, A.K. Sikder, Chemical mechanical planarization for microelectronics applications, Materials Science and Engineering R 45 (2004) 89–220
4. Sean Eichenlaub, Gautam Kumar, Stephen Beaudoin, A modeling approach to describe the adhesion of rough, asymmetric particles to surfaces, Journal of Colloid and Interface Science 299 (2006) 656–664
5. A.A. Busnaina, T.M. Elsawy, Post CMP cleaning using acoustic streaming, J. Electron. Mater. 27(10) (1998) 1095 (special issue paper).
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