Assessment of post-CMP cleaning mechanisms using statistically-designed experiments-Reference-Cited by-同舟云学术

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Assessment of post-CMP cleaning mechanisms using statistically-designed experiments

Published:1998-11 Issue:1-2 Volume:332 Page:379-384
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Zhang G.,Burdick G.,Dai F.,Bibby T.,Beaudoin S.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. D. Kumar, R. Singh, The Metals, Minerals and Materials Society Conference, San Antonio, TX, 1998.

2. Intermolecular and Surface Forces;Israelachvili,1991

3. Handbook of Semiconductor Wafer Cleaning Technology: Science, Technology, and Applications;Donovan,1993

4. An Analysis of Particle Adhesion on Semiconductor Surfaces

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