Author:
Angelucci R.,Merli M.,Dori L.,Pizzochero G.,Solmi S.,Canteri R.
Publisher
Springer Berlin Heidelberg
Reference8 articles.
1. Murarka, S.P.: Microelectronic Materials and Processing, R.A. Leavy ed. Academic Press, New York 1988, 257–328.
2. Wong, D.L.; Ku, Y.H.; Lee, S.K.; Louis, E.; Alvi, N.S.; Chu, P.: J. Appl. Phys. 61 (1987) 5084.
3. Van Den Hove, L.; Wolters, R.; Maex, K.; De Keersmaecker, R.F.; Declerck, G.J.: IEEE Trans. Electron Devices 34 (1987) 554.
4. Tsaur, B-Y.; Chen, C.K.; Anderson Jr., C.H.; Kwong, D.L.: J. Appl. Phys. 57 (1985) 1890.
5. Laborde, O.; Thomas, O.; Senateur, J.P.; Madar, R.: J. Phys. F: Met. Phys. 16 (1986) 1745.
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Metal Silicides: Active elements of ULSI contacts;Journal of Electronic Materials;1996-11
2. Silicides;Rapid Thermal Processing;1993
3. Shallow junctions for ULSI technology;European Transactions on Telecommunications;1990-03