Floor Planning of 3D IC Design Using Hybrid Multi-verse Optimizer
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Computer Science Applications
Link
https://link.springer.com/content/pdf/10.1007/s11277-021-08166-z.pdf
Reference16 articles.
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2. Chiang, T.-Y., Souri, S. J., Chui, C. O., & Saraswat, K. C. (2001). Thermal analysis of heterogeneous 3D ICs with various integration scenarios. In International electron devices meeting. Technical digest (Cat. No. 01CH37224) (pp. 31.2.1–31.2.4).
3. Cong, J., Wei, J., & Zhang, Y. (2004). A thermal-driven floorplanning algorithm for 3D ICs. In Proceedings of the 2004 IEEE/ACM international conference on computer-aided design (pp. 306–313).
4. Zhou, P., Ma, Y., Li, Z., Dick, R. P., Shang, L., Zhou, H., et al. (2007). 3D-STAF: Scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits. in Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design (pp. 590–597).
5. Sivaranjani, P., & Senthil Kumar, A. (2017). Hybrid particle swarm optimization-firefly algorithm (HPSOFF) for combinatorial optimization of non-slicing VLSI floorplanning. Journal of Intelligent & Fuzzy Systems, 32, 661–669.
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