1. LI J, HAN L, DUAN J, ZHONG J. Interface mechanism of ultrasonic flip chip bonding [J]. Applied Physics Letters, 2007, 90(24): 242902.
2. LI Jun-hui, HAN Lei, ZHONG Jue. The characteristics of ultrasonic vibration transmission and coupling in bonding technology [C]// Proceedings of the 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. Shanghai, 2004: 311–315.
3. ELGER G, HUTTER M, OPPERMANN H. Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering [J]. Microsystem Technology, 2002, 7(5): 239–243.
4. TAIZO T. Thermosonic flip chip bonding for low cost packaging [C]// 2002 International Symposium on Microelectronics. Denver, CO, United States, 2002: 360–365.
5. LI J H, HAN L, ZHONG J. Interface structure of ultrasonic wedge bonding joints of Ni/Al [J]. Trans Nonferrous Met Soc China, 2005, 15(4): 846–850.