Author:
Chin Swee-Boon,Foo Ji-Jinn,Lai Yin-Ling,Yong Terry Kin-Keong
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Reference16 articles.
1. Sparrow EM, Ramsey JW, Altermani CAC (1980) Experiments on in-line pin-fins arrays and performance comparison with staggered arrays. ASME J Heat Transf 102:44–50
2. Khan WA, Culham JR, Yovanovich MM (2008) Modelling of cylindrical pin-fin heat sinks for electronics packaging. IEEE Trans Compon Packag Technol 31:536–545
3. Tahat M, Kodah ZH, Jarrah BA, Probert SD (2000) Heat transfer from pin fin arrays experiencing forced convection. Appl Energy 67:419–442
4. Bilen K, Akyol U, Yapici S (2001) Heat transfer and friction correlations and thermal performance analysis for a finned surface. Energy Convers Manag 42:1071–1083
5. Soodphakdee D, Behnia M, Copeland DW (2001) A comparison of fin geometries for heat sinks in laminar forced convection: part I—round, elliptical, and plate fins in staggered and in-line configurations. Int J Microcircuits Electron Packag 24:68–76
Cited by
80 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献