Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards-Reference-Cited by-同舟云学术

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Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards

Published:2014-07-25 Issue:3 Volume:51 Page:335-342
ISSN:0947-7411
Container-title:Heat and Mass Transfer
language:en
Short-container-title:Heat Mass Transfer

Author:

Géczy Attila,Illés Balázs,Péter Zsolt,Illyefalvi-Vitéz Zsolt

Publisher

Springer Science and Business Media LLC

Subject

Fluid Flow and Transfer Processes,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s00231-014-1386-1.pdf

Reference22 articles.

1. Leicht H, Thumm A (2008) Today’s Vapor Phase Soldering—an optimized reflow technology for lead free soldering. SMTA 2008:45

2. Pfahl RC, Ammann HH (1975), Method for soldering, fusing or bracing. US Patent 3,866,307

3. Leider W (2002) Dampfphasenlöten – Grundlagen und praktische Anwendung. Eugen G. Leuze Verlag, Bad Saulgau, pp 31–39

4. Krammer O, Garami T (2011) Comparing the intermetallic layer formation of infrared and vapour phase soldering. IEEE-ISSE 34:196–201

5. Duck A, Zabel C (2010) Vapour phase reflow—profiling for lead free alloys. SMTA 2010:2

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Navier slip on film condensation heat transfer over upward facing horizontal flat surfaces with free edges;International Communications in Heat and Mass Transfer;2021-12

2. Capacitive Sensors for Saturated Vapour Height Sensing in VPS Soldering;2020 43rd International Spring Seminar on Electronics Technology (ISSE);2020-05

3. Effect of different thermocouple constructions on heat-level vapour phase soldering profiles;Soldering & Surface Mount Technology;2020-03-31

4. Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect);Journal of Materials Processing Technology;2018-01

5. Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering;International Journal of Heat and Mass Transfer;2017-06

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